" ITREALMS: Intel, Siemens collaborate on 2G VoIP

Wednesday, September 27, 2006

Intel, Siemens collaborate on 2G VoIP

Remmy Nweke

Intel Corporation and Siemens Communications have established technology relationship to collaborate in creating an open unified communications solutions based on Voice over Internet Protocol (VoIP), based on Second Generation (2G).

The companies also agreed to jointly fund and cooperatively conduct research focused on secure wireless networks and real-time open unified communications in the short term as well as working together in a longer term through creating comprehensive vertical industry collaboration solutions to drive business process optimization for key market segments.

The firms equally said the collaboration would include telecommunications service provision, financial services and digital healthcare.

Components of the agreement that was sealed weekend in Munich, Germany, called for the two companies to establish joint market development efforts focused on the enterprise and service provider sectors.

The overall goal of the joint effort is to demonstrate real time communications solutions for business process optimization using Intel architecture such as Intel dual-core technology and carrier class Rack Mounted Servers (RMS) from Intel and the HiPath 8000 and OpenScape from Siemens.

A press statement made available to our correspondent and endorsed by the vice president sales and marketing group at Intel, Mr. Gordon Graylish, and President, Enterprise Systems at Siemens Communications, Mr. Thomas Zimmermann explained that the first step would be to demonstrate the OpenScape platform running applications such as personal portal, unified communications, video and voice conferencing and mobile clients.

In addition, Intel and Siemens expect to present findings and display the first wave of technology solutions developed at an Intel lab in the United States, to selected customers by the fourth quarter of 2006.

Mr. Graylish, who also is the general manager, Europe, Middle East and Africa noted, “Intel’s experience as the leading provider of silicon technology to the enterprise market world wide and established track record of industry collaboration puts it in a great position to shape the enterprise of the future. As a result of this collaboration, enterprise customers will be able to avail themselves of unified communications based on the industry’s highest performance and most cost effective architecture.”

On the other hand, Mr. Zimmermann said “Siemens has a strong commitment to this joint development effort and to ongoing collaboration with Intel to unlock the potential of our open unified communication enterprise solutions to a global ecosystem of third party independent software providers and systems integrators.”

He also said, that growth potential for the open unified communications market is significant and customer base for the HiPath 8000 solution has more than doubled since the first quarter of the year, stressing that Siemens is adding a new HiPath 8000 customer nearly every week.”

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