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Wednesday, September 19, 2007

OQO ships first batch of1.6GHz VIA processors

California-based OQO Incorporated has commenced shipping of VIA Tech 1.6 Gega Hertz C7-M ULV processor, thus making the firm the first to do so in the history of this new product.

Revealing this development, Vice President, Corporate Marketing, VIA Technologies Incorporated, Mr. Richard Brown, informed that OQO Inc. is the first manufacturer to ship the 1.6GHz VIA C7-M ULV processor in the latest configurations of its award-winning model 02-product line.

He explained that the higher-speed processor in its updated version of model 02, is the world’s smallest full-featured Windows Vista Personal Computer that would further increase the device’s performance, thus enabling mobile professionals to enhance their anytime, anywhere productivity.

Additionally, he said that its a faster processor featuring configurations with options such as support for the super fast Evolution Data Optimisation “EVDO Rev,” a high-speed wireless transmission standard, which delivers data rates of up to 1.4 Mega bytes per seconds (Mbps), improved upstream speed and lower latency.

He noted that the updated version also offers enhanced storage capacity of up to 120 Gega Bytes (GB), and a Solid-State-Drive (SSD) option available.

“We are delighted that OQO has adopted our 1.6GHz VIA C7-M ULV processor for their model 02 computer,” he declared, adding that it provides further evidence of VIA Tech leadership in developing cutting-edge platforms for the rapidly growing Ultra Mobile Devices (UMD) market.

Equally speaking, the senior vice president, marketing & alliances at OQO, Mr. Bob Rosin, his firm has once again extended the performance envelope of ultra mobile computing by making the first shipment on 1.6GHz of the model 2 product lines.

“With its faster Computer Processing Unit (CPU), increased hard drive capacities, SSD option and improved wireless capability, the new model 02 is the ultimate device for mobile professionals who want access to all their information, applications and the Internet wherever they go,” he said.

Mr. Brown further added that with this, VIA’s core design strengthens low power usage, extreme miniaturization and a wide range of integrated features have made the VIA Ultra Mobile Platform and the VIA C7-M ULV processor the number one choice for the emerging new generation of Ultra Mobile Devices, which deliver full PC functionality and a complete, no-compromise Internet experience in an ultra compact form factor.

The VIA C7-M Ultra Mobile Platform, Mr. Brown explained was based on the low power drawing VIA C7-M ULV x86 processor, which has been specifically designed for small form-factor UMDs. “The VIA C7-M ULV processor is based on the VIA CoolStream architecture and manufactured using an advanced 90nm process, and has a low profile nanoBGA2 package measuring just 21mm x 21mm,” he said.

According to him, VIA C7-M ULV processors are available at speeds of 1.0-1.6GHz with a maximum Thermal Design Power (TDP) as low as 3.5 watts and idle power as little as 0.1 watt, ensuring unparalleled battery life. This is complemented by a highly integrated and power efficient unified chipset, enabling designs with drastically reduced weight, size and thickness.

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